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发表于 2026-1-19 21:35:58
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Study of the protrusion of through-silicon vias in dual annealing-CMP processes for 3D integration% h9 Q/ s# u1 L# @$ I+ D2 T p2 ~
Tianjian Liu, Shizhao Wang, Fang Dong, Yang Xi, Yunpeng Zhang, Tao He, Xiang Sun & Sheng Liu
" H) C# Y" i; |4 p3 Y! m6 GMicrosystems & Nanoengineering volume 11, Article number: 25 (2025)
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https://www.nature.com/articles/s41378-024-00797-z
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: w, B2 c8 a0 o4 _0 qSheng Liu
2 B5 ~2 X9 F- s# Q4 J$ T, J* TSchool of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China- W% q( O; M6 _6 z4 U
School of Power and Mechanical Engineering, Wuhan University, Wuhan, China |
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