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发表于 2026-1-19 21:35:58
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Study of the protrusion of through-silicon vias in dual annealing-CMP processes for 3D integration
. W5 v% c6 X" D" ]7 dTianjian Liu, Shizhao Wang, Fang Dong, Yang Xi, Yunpeng Zhang, Tao He, Xiang Sun & Sheng Liu
- k- M0 A) D& |Microsystems & Nanoengineering volume 11, Article number: 25 (2025) ( y- ? \: p4 Q4 s% ?: E
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https://www.nature.com/articles/s41378-024-00797-z
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Sheng Liu6 e9 h6 [* h& f: _8 t
School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China
+ q7 [! A' u) l7 ~ ~8 SSchool of Power and Mechanical Engineering, Wuhan University, Wuhan, China |
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